Epoxy Bond Line Control Kits

To enhance the bond lines of epoxy resin, glass microspheres can be added to the resin mix. These tiny glass beads, also known as Bond Line Controllers, improve the performance of the resin and the final bond in various ways. They create a more even disbursement that wets easily to surfaces and allows for a higher filler loading. They also reduce viscosity, improve epoxy flow, enhance dimensional stability, and minimize epoxy shrinkage.