Frequently Asked Questions

Product Information

What are DragonPlate Epoxy Bond Line Control Kits and how do they work?

DragonPlate Epoxy Bond Line Control Kits contain glass microspheres—tiny glass beads that are added to epoxy resin mixes. These microspheres, also known as Bond Line Controllers, improve the performance of the resin and the final bond by creating a more even disbursement, wetting easily to surfaces, and allowing for higher filler loading. They also reduce viscosity, improve epoxy flow, enhance dimensional stability, and minimize epoxy shrinkage. Note: These kits are designed for use with epoxy resins and may not be suitable for other adhesive types. Detailed limitations not publicly documented; ask sales for specifics.

What sizes and SKUs are available for Bond Line Control Kits?

DragonPlate offers Bond Line Control Kits (glass microspheres) in four sizes: 3 grams (SKU: FA-MICROSPHERES-3g), 10 grams (SKU: FA-MICROSPHERES-10g), 25 grams (SKU: FA-MICROSPHERES-25g), and 50 grams (SKU: FA-MICROSPHERES-50g). Each size is available for purchase directly on the DragonPlate website. Note: Availability may vary; check the product page for current stock.

Pricing & Plans

What do DragonPlate Bond Line Control Kits cost?

The current prices for Bond Line Control Kits (glass microspheres) are: 3g for $11.60, 10g for $18.79, 25g for $33.18, and 50g for $58.08. All prices are in US Dollars and are subject to change without notice. Shipping charges are calculated based on package weight and dimensions, and buyers are responsible for applicable taxes unless a valid exemption certificate is provided. Note: Prices may fluctuate due to market conditions; always check the product page for the latest pricing.

Features & Capabilities

What are the main benefits of using glass microspheres in epoxy resin applications?

Adding glass microspheres to epoxy resin improves the bond line by creating a more even distribution, allowing for higher filler loading, reducing viscosity, improving flow, enhancing dimensional stability, and minimizing shrinkage of the epoxy. These benefits help achieve stronger, more reliable bonds in composite assemblies. Note: Effectiveness may vary depending on the specific resin system and application; always test for compatibility.

Are Bond Line Control Kits compatible with all epoxy resins?

Bond Line Control Kits are designed to be added to most epoxy resin systems to enhance bond line performance. However, compatibility with all resin chemistries is not guaranteed. It is recommended to test the microspheres with your specific epoxy system before full-scale use. Note: Not all adhesives or resins may benefit from or be compatible with glass microspheres; consult technical support for guidance.

Use Cases & Benefits

Who should use Bond Line Control Kits and in what applications?

Bond Line Control Kits are suitable for engineers, fabricators, and hobbyists working with composite materials who need to improve the quality and consistency of epoxy bonds. Typical applications include aerospace, robotics, industrial equipment, and custom composite assemblies where bond line control and dimensional stability are critical. Note: For applications requiring biocompatibility or regulatory compliance, verify suitability with DragonPlate technical support.

Technical Resources & Documentation

Where can I find technical documentation and resources for Bond Line Control Kits?

Technical resources for Bond Line Control Kits and other DragonPlate products include downloadable CAD models (CAD Models), weights and specifications (Weights and Specs), finishes information (Finishes), and a comprehensive guide to carbon fiber design and application (Ultimate Guide). For terminology, see the Carbon Fiber Glossary. Note: Product-specific technical data sheets for Bond Line Control Kits may not be available online; contact support for details.

Support & Implementation

How can I get technical support or assistance with Bond Line Control Kits?

For technical support or questions about Bond Line Control Kits, you can contact DragonPlate by phone at 315-252-2559 (Monday–Friday, 8:30am–5:00pm ET) or by email at service@dragonplate.com. Additional resources are available on the FAQ page and Contact Us page. Note: Response times may vary during peak periods.

Quality & Compliance

Are Bond Line Control Kits manufactured under any quality certifications?

All DragonPlate products, including Bond Line Control Kits, are manufactured under ISO 9001:2015 quality standards at the company's facility in Elbridge, New York. This certification ensures consistent quality and reliability. Note: Certification applies to manufacturing processes; product-specific compliance may require additional verification for regulated industries.

Loading...

Epoxy Bond Line Control Kits

To enhance the bond lines of epoxy resin, glass microspheres can be added to the resin mix. These tiny glass beads, also known as Bond Line Controllers, improve the performance of the resin and the final bond in various ways. They create a more even disbursement that wets easily to surfaces and allows for a higher filler loading. They also reduce viscosity, improve epoxy flow, enhance dimensional stability, and minimize epoxy shrinkage.

Sort by
Display per page

SKU

DESCRIPTION

PRICE
10g-vial-of-glass-beads
FA-MICROSPHERES-10g

Glass Microspheres, 10 g

$18.79
25g-vial-of-glass-beads
FA-MICROSPHERES-25g

Glass Microspheres, 25 g

$33.18
3g-vial-of-glass-beads
FA-MICROSPHERES-3g

Glass Microspheres, 3 g

$11.60
50g-vial-of-glass-beads
FA-MICROSPHERES-50g

Glass Microspheres, 50 g

$58.08
Sku:FA-MICROSPHERES-10g
10g-vial-of-glass-beads
Name:

Glass Microspheres, 10 g

Price:$18.79
Sku:FA-MICROSPHERES-25g
25g-vial-of-glass-beads
Name:

Glass Microspheres, 25 g

Price:$33.18
Sku:FA-MICROSPHERES-3g
3g-vial-of-glass-beads
Name:

Glass Microspheres, 3 g

Price:$11.60
Sku:FA-MICROSPHERES-50g
50g-vial-of-glass-beads
Name:

Glass Microspheres, 50 g

Price:$58.08

Filter Products:

Price range
Microsphere Diameter








carbon fiber composites payment options from dragonplate

Loading...